Qualcomm has launched two new AI chips, the AI200 and AI250, aimed at competing with Nvidia and AMD in the data center market. The announcement led to a significant 15% rise in Qualcomm's stock price as it positions itself as a serious contender in the semiconductor industry.

The article discusses the innovative use of diamond blankets to enhance thermal conductivity in semiconductor chips, addressing the growing challenge of heat management as transistors become denser and more powerful. By utilizing a micrometers-thick integrated diamond layer, heat can be effectively spread across the chip, preventing performance throttling and improving the efficiency of high-performance processors.